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普通线路板 |
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Item No: 8-Layer PCB |
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基材: FR-4 |
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板厚: 1.6mm |
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层数: 8/l |
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尺寸: 380mm*250mm |
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线宽: 8mil(0.2mm) |
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线距: 8mil(0.2mm) |
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最小孔径:0.30mm |
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镀层工艺: 喷锡、BGA塞孔 |
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文件格式: 光绘文件(RS274-X) |
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过孔孔径: 12mil (0.30mm) |
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|
普通线路板 |
|
Item No: 8-Layer PCB |
|
基材: FR-4 |
|
板厚: 1.6mm |
|
层数: 8/l |
|
尺寸: 380mm*250mm |
|
线宽: 8mil(0.2mm) |
|
线距: 8mil(0.2mm) |
|
最小孔径:0.30mm |
|
镀层工艺: 喷锡、BGA塞孔 |
|
文件格式: 光绘文件(RS274-X) |
|
过孔孔径: 12mil (0.30mm) |
|
|
普通线路板 |
|
Item No: 8-Layer PCB |
|
基材: FR-4 |
|
板厚: 1.6mm |
|
层数: 8/l |
|
尺寸: 380mm*250mm |
|
线宽: 8mil(0.2mm) |
|
线距: 8mil(0.2mm) |
|
最小孔径:0.30mm |
|
镀层工艺: 喷锡、BGA塞孔 |
|
文件格式: 光绘文件(RS274-X) |
|
过孔孔径: 12mil (0.30mm) |
|
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8层线路板 |
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Item No: 8-Layer PCB |
|
基材: FR-4 |
|
板厚: 1.6mm |
|
层数: 8/l |
|
尺寸: 380mm*250mm |
|
线宽: 8mil(0.2mm) |
|
线距: 8mil(0.2mm) |
|
最小孔径:0.30mm |
|
镀层工艺: 喷锡、BGA塞孔 |
|
文件格式: 光绘文件(RS274-X) |
|
过孔孔径: 12mil (0.30mm) |
|
|
普通线路板 |
|
Item No: 8-Layer PCB |
|
基材: FR-4 |
|
板厚: 1.6mm |
|
层数: 8/l |
|
尺寸: 380mm*250mm |
|
线宽: 8mil(0.2mm) |
|
线距: 8mil(0.2mm) |
|
最小孔径:0.30mm |
|
镀层工艺: 喷锡、BGA塞孔 |
|
文件格式: 光绘文件(RS274-X) |
|
过孔孔径: 12mil (0.30mm) |
|
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6 层阻抗板 |
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Item No: 6-Layer PCB |
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基材: FR-4 |
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板厚: 2.0mm |
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层数: 6/L |
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尺寸: 127 mm X 139.7 mm |
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线宽: 6mil (0.15mm) |
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线距: 6mil (0.15mm) |
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最小孔径:0.60mm |
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镀层工艺: 喷锡 |
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文件格式: 光绘文件(RS274-X) |
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过孔孔径: 25mil (0.60mm) |
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